DX-1/2/2A TYPE X-RAY ORIENTATION UNIT FOR SINGLE CRYSTAL
DX-3/4/4A TYPE HIGH-ACCURACY X-RAY ORIENTATION UNIT FOR SINGLE CRYSTAL
DX-5/6 TYPE HIGH-ACCURACY X-RAY ADHESIVE ORIENTATION UNIT
DX-5C TYPE ULTRAHIGH PRECISION X-RAY QUARTZ BAR SET UNIT
DX-5D TYPE HIGH PRECISION SC-CUT X-RAY QUARTZ BAR UNIT
DX-7 TYPE X-RAY ORIENTATION UNIT FOR BIG CRYSTAL BAR
DX-7 TYPE  SEMICONDUTOR SEED X-RAY ORIENTATION UNIT
DX-7A TYPE X-RAY ORIENTATION UNIT FOR SILICON WAFER
DX-7B TYPE CRYSTAL INGOT X-RAY ORIENTATION UNIT
DX-7C TYPE SILICON CRYSTAL INGOT X-RAY ORIENTATION UNIT
DX-7CF TYPE SILICON CRYSTAL INGOT X-RAY RE-MEASORE UNIT
DX-7CZ TYPE SILICON CRYSTAL INGOT STICK UNIT
DX-8 TYPE X-RAY ORIENTATION UNIT FOR TUMBLING MILL
DX-8A TYPE VERTICAL SEMICONDUCTOR OF-PLANE X-RAY ORIENTATION UNIT
DX-8B TYPE HORIZONTAL SEMICONDUCTOR OF-PLANE X-RAY ORIENTATION UNIT
DX-9B TYPE X-RAY BACKSWING CURVE MEASURING INSTRUMENT
DX-9/9A TYPE SEMI-AUTOMATIC X-RAY ORIENTATION UNIT FOR SINGLE CRYSTAL
DX-9C TYPE X-RAY ORIENTATION UNIT FOR SC CUTTING WAFER
DXD-1 TYPE ANY DEVIATION ANGLE CRYSTAL X-RAY ORIENTATION DISTINGUISH UNIT

¦DX-7 TYPE  SEMICONDUTOR SEED X-RAY ORIENTATION UNIT

¦ Description

This unit is used for silicon seed ,it can also be used for other kinds of semiconductor seed to orient.

The unit has two workplaces . The goniometer on the right is used to orient the end side of silicon single crystal ingot , then cut the ingot into some seeds on the inner-circle cutting machine . The goniometer on the left is used to orient the seeds.

The specifications in below table:

Items specifications
Ingot diameter
Ingot length 
Crystal plane
Orient accuracy
Min. reading
φ110
140
111, 100
±30″
1"

Note:If the client has the different demand, can negotiate.