¦ DX-9C TYPE X-RAY ORIENTATION UNIT FOR SC CUTTING WAFER
¦ Description
The apparatus is used for the orientation of crystal SC-cutting wafer, with same hardware structure as DX-9B, but different software. It consists of test desk, high viltage generator and computer analysis system. The test desk is mainly composed of copper target X-ray tube (30kV, 1mA), geiger tube and push-in SCM system, equipped with monochromator as well. The real time data acquired by the SCM are transmitted to the computer analysis system to be processed.
The computer analysis system is composed of the computer, data analysis software and printer. It processes the real time data and displays the cutting angle on the computer screen, then outputs the testing results by the printer. The accuracy of measured cutting angle is ±15″and the least reading is 1″.
It is equipped with ray window electromagnetic optical gate and reliable radial protective cover, which guarantee the safe handling.
The apparatus can be made into table model (as picture above) or other types, among which:
Overall Dimensions of Worktable: 1500(length)×700(width)×750(height)
Weight of Test Desk: 75kg
Weight of High Voltage Generator: 65kg.