■DX-1/2/2A TYPE X-RAY ORIENTATION UNIT FOR SINGLE CRYSTAL
■DX-3/4/4A TYPE HIGH-ACCURACY X-RAY ORIENTATION UNIT FOR SINGLE CRYSTAL
■DX-5/6 TYPE HIGH-ACCURACY X-RAY ADHESIVE ORIENTATION UNIT
■DX-5C TYPE ULTRAHIGH PRECISION X-RAY QUARTZ BAR SET UNIT
■DX-5D TYPE HIGH PRECISION SC-CUT X-RAY QUARTZ BAR UNIT
■DX-7 TYPE X-RAY ORIENTATION UNIT FOR BIG CRYSTAL BAR
■DX-7 TYPE  SEMICONDUTOR SEED X-RAY ORIENTATION UNIT
■DX-7A TYPE X-RAY ORIENTATION UNIT FOR SILICON WAFER
■DX-7B TYPE CRYSTAL INGOT X-RAY ORIENTATION UNIT
■DX-7C TYPE SILICON CRYSTAL INGOT X-RAY ORIENTATION UNIT
■DX-7CF TYPE SILICON CRYSTAL INGOT X-RAY RE-MEASORE UNIT
■DX-7CZ TYPE SILICON CRYSTAL INGOT STICK UNIT
■DX-8 TYPE X-RAY ORIENTATION UNIT FOR TUMBLING MILL
■DX-8A TYPE VERTICAL SEMICONDUCTOR OF-PLANE X-RAY ORIENTATION UNIT
■DX-8B TYPE HORIZONTAL SEMICONDUCTOR OF-PLANE X-RAY ORIENTATION UNIT
■DX-9B TYPE X-RAY BACKSWING CURVE MEASURING INSTRUMENT
■DX-9/9A TYPE SEMI-AUTOMATIC X-RAY ORIENTATION UNIT FOR SINGLE CRYSTAL
■DX-9C TYPE X-RAY ORIENTATION UNIT FOR SC CUTTING WAFER
■DXD-1 TYPE ANY DEVIATION ANGLE CRYSTAL X-RAY ORIENTATION DISTINGUISH UNIT

¦ DX-5/6 TYPE HIGH-ACCURACY X-RAY ADHESIVE ORIENTATION UNIT
¦ Description
The apparatus has two workplaces, the left goniometer is used to measure high-accuracy wafer and the right is used as crystal bar adhesive device. The unit has its crystal bar oriented by big R-surface and fine adjusted by micrometer, and the cutting angle is ajusted by the goniometer. It is mainly used for AT cutting and it is also available for BT cutting. According to customers' requirement, it's designed into four types-DX-5A/5B, 6A/6B, and the differences are as follows:
DX-5A/5B Type: crystal bar's +X surface upward adhesion; DX-6A/6B: crystal bar's +X surface downward adhesion.
DX-5B/6B Type: wide profile, the crystal bar is adhered in the middle of the flitch in favor of the performance and service life of the knife and the frame.
Main parameters and characteristics are as follows:
Item 5A, 6A Type 6A, 6B Type
Flitch Dimensions
Crystal Bar Thickness
Adhesive Layer Number
Adjusting Means of Adhesive Layer Number
Adhesive Accuracy of Crystal Bar on Flitch
Display Mode of Adhesive Accuracy
Least Reading of Cutting Angle
Flitch Fixed Form
Flitch Move Mode
Host Machine Type
330×200×20
10, 9, (8, 7)
5(6)
filling block

±15?

digital/analog meter, with peak memory function
1″

eletromagnet
precision guide rail
DX－4A
250×250×20
10, 9, (8, 7)
5(6)
filling block

±15?

digital/analog meter, with peak memory function
1″

eletromagnet
precision guide rail
DX－4A
¦ Notes:
1. Since the apparatus is applied to the adhesion of crystal bars of various thickness, it demands the big R-surface is large enough. The crystal bar has better be cut by Z-block,if cut by Y-block, there should be another cutting in parallel with big R-surface so as to enlarge the area of big R-surface.
2. Customers' requirements for different flitch dimensions and crystal bar thickness are also accepted for further discussion.