The apparatus is used to orient and measure the silicon single crystal wafer surface and reference plane after cutting. It can also be used to other kinds of single crystal wafer. The apparatus matches with the vacuum pump. The measure diameter range is 3~8 inch and the measure crystal plane is 100, 110, 111, 210 and so on. The accuracy of the measurement is ± 30 ″and the least reading is 10 ″. The apparatus has two workplaces which can finish the same task at the same time, and it can also be used to measure the wafer surface at one workplace, and the reference plane at the other workplace, according to client's requirement.
It adopts DX-2 type orientation unit as the host machine and we can supply customers with other type of main machines (for example DX-4A: accuracy: ± 15 ″, least reading: 1 ″) if clients demand so. Clients requirements are also accepted to design various types of instruments for special purposes. |