■DX-1/2/2A TYPE X-RAY ORIENTATION UNIT FOR SINGLE CRYSTAL
■DX-3/4/4A TYPE HIGH-ACCURACY X-RAY ORIENTATION UNIT FOR SINGLE CRYSTAL
■DX-5/6 TYPE HIGH-ACCURACY X-RAY ADHESIVE ORIENTATION UNIT
■DX-5C TYPE ULTRAHIGH PRECISION X-RAY QUARTZ BAR SET UNIT
■DX-5D TYPE HIGH PRECISION SC-CUT X-RAY QUARTZ BAR UNIT
■DX-7 TYPE X-RAY ORIENTATION UNIT FOR BIG CRYSTAL BAR
■DX-7 TYPE  SEMICONDUTOR SEED X-RAY ORIENTATION UNIT
■DX-7A TYPE X-RAY ORIENTATION UNIT FOR SILICON WAFER
■DX-7B TYPE CRYSTAL INGOT X-RAY ORIENTATION UNIT
■DX-7C TYPE SILICON CRYSTAL INGOT X-RAY ORIENTATION UNIT
■DX-7CF TYPE SILICON CRYSTAL INGOT X-RAY RE-MEASORE UNIT
■DX-7CZ TYPE SILICON CRYSTAL INGOT STICK UNIT
■DX-8 TYPE X-RAY ORIENTATION UNIT FOR TUMBLING MILL
■DX-8A TYPE VERTICAL SEMICONDUCTOR OF-PLANE X-RAY ORIENTATION UNIT
■DX-8B TYPE HORIZONTAL SEMICONDUCTOR OF-PLANE X-RAY ORIENTATION UNIT
■DX-9B TYPE X-RAY BACKSWING CURVE MEASURING INSTRUMENT
■DX-9/9A TYPE SEMI-AUTOMATIC X-RAY ORIENTATION UNIT FOR SINGLE CRYSTAL
■DX-9C TYPE X-RAY ORIENTATION UNIT FOR SC CUTTING WAFER
■DXD-1 TYPE ANY DEVIATION ANGLE CRYSTAL X-RAY ORIENTATION DISTINGUISH UNIT

¦ DX-8 TYPE X-RAY ORIENTATION UNIT FOR TUMBLING MILL
¦ Description
The apparatus is used for the orientation and measurement of the cylindrical surface of large-diameter silicon single-crystal wafer, as well as the single-crystal orientation and measurement of other kinds of materials.

DX-8 is specially used for the combination with tumbling mill orienting for the cylindrical surface of crystal bar and it can also be used to reconstruct tumbling mills without orientation units on them. The accuracy of the measurement is ± 30 ″and the least reading is 10 ″.

It adopts DX-2 type orientation unit as the host machine and we can supply customers with other type of main machines (for example DX-4A: accuracy: ± 15 ″, least reading: 1 ″) if clients demand so. Clients requirements are also accepted to design various types of instruments for special purposes.