Product Classification
DX-7CF TYPE SILICON CRYSTAL INGOT X-RAY RE-MEASURE UNIT

Description             
This unit is specially used to re-measure the accuracy of orientation by x-ray and sticking of the angles . The ingots are orientated in the DX-7C type orientation unitand then are glued on the saw plate (work holder) in the DX-7CZ type stick unit , at last they will be measured in this  re-measure unit . The units are all products of our company and work with the multi-wire saw . 
The unit has one workplace , there are carried board , fixtures and the fixed set for the saw plate on it . The ingots will measure after the ingots , the beam (black lead /glass/ badelite) , the saw plate glued together and the saw plate fixed by the fixed set , the end is re-measured under X-ray two ingots can be only re-measured on the saw plate .

The specifications in below table

Items Specifications
Ingot diameter 2~8 inch
Ingot length max. 500
Crystal plane 111,100
Orient accuracy ±30″
Min . reading 1″
Saw plate length max. 500
Saw plate width  70, 100

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